Frame scale package using contact lines through the elements

ABSTRACT

A package for an integrated circuit contacting device which is shaped like a frame. A portion of the contacting device may be bonded to the printed circuit board, and includes leads which extend along in outer surface thereof, from an outside edge of the package to a downward facing surface of the package which faces an integrated circuit die. The package may be in dented in the shape of the die, and may also include indentations allowing a lid and/or a back portion to be located thereon. In an embodiment, a lens amounts may also be used.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority from provisional application No.60/245,085, filed Nov. 1, 2000.

BACKGROUND

Many different systems are known for packaging integrated circuits.Standard packages come by many different names. However, many of thesepackages have the same object: to package an active part of anintegrated circuit, a “die”, in a way that protects the die, but alsoallows electrical communication to and from the die.

SUMMARY

The present application teaches a frame scale package which may hold thedie around its edges and effectively frames the die. The system may havesignificant advantages, including better protection of the die againstthe environment.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other aspects will now be described in detail with respect tothe accompanying drawings wherein:

FIGS. 1A and 1B show respective side and top views of a first embodimentof a basic frame package for an image sensor;

FIG. 2 shows a frame package side view with a lid;

FIG. 3 shows a frame package with lid and having a lens mount; and

FIG. 4 shows a totally sealed frame scale package with a lead and rearportion.

DETAILED DESCRIPTION

FIGS. 1A and 1B show a first embodiment of the frame scale package. FIG.1 a shows the side view, showing the die element 100, which is anintegrated circuit with an image sensor element integrated thereon.Preferably, the image sensor element is an active pixel sensor, of thetype described in U.S. Pat. No. 5,471,215. As conventional, the die 100includes contact portions 105 along an outer edge thereof, which enableelectrical connection to the circuitry on the die. Electrical connectionincludes connections for power and signals.

The frame package is formed by an outer package element 120 which has aninner perimeter area 125 that is “stepped”, which is to say that it hasa first portion 126 which is slightly smaller than the die outerperimeter, and a thinned portion, where the thickness is reduced so thatit can connect to the outer edges of the die. The outer perimeter 130has a greater thickness than the inner perimeter, again with thedifference in thicknesses being sufficient to accommodate the thicknessof the die.

The outer surface of the frame includes a plurality of metal contactlines 140. The metal contact lines 140 may extend, as shown in FIG. 1Aand FIG. 1B, from the outer perimeter 130 of the frame, along the bottomsurface of the frame 132, along the step portion 133 of the innerperimeter of the frame, and along the bottom surface 134 of the innerportion of the frame. A connection 145 to the die 100 may be made at thelocation where the contact extends along the inner portion of the frame.The outer perimeter 140 also has a metal contact line, enabling acontact to be made at that frame package location.

The frame package may also be bonded to the printed circuit board alongeither or both of the surfaces 130,132.

FIG. 1B shows how a plurality of contact areas for the printed circuitboard lines may be provided. While the figure shows only a few contactsbeing made, of course there may be many more contacts.

In operation, the frame package forms a structure like a frame aroundthe rectangular die. The bond pads on the die may contact the leads onthe package via direct soldering rather than wire bonding, analogous tothe way that connections are carried out in flip chip bonded diemounting. The leads in the frame scale package may also be soldereddirectly to a printed circuit board.

In FIGS. 1A and 1B, an image sensor die 100 is placed face up into thepackage, and may fit snugly inside the inner perimeter of the package asshown. Since the package forms a frame around the die, portions of thepackage may contact the die at its outer edges. The die is prepared withsolder bumps located on its bonded tabs in the areas 105.

Once the package is placed around the die, the system is heated to meltthe solder bumps. This thereby bonds the die to the frame package leads.The leads of the package run from the die contacts, along the area onthe underside of the package, and may also run out along the outerperimeter of the package for lead bonding to the printed circuit board.

Other embodiments may provide other structures that associate with andprotect or work with the die. The FIG. 2 embodiment includes a similarpackage which includes flanges on the frame package; not only at itsbottom portion 210, but also at the top portion 220. The top frame 220may receive a glass lid 230 which is separated from the die 100 by anair gap shown as 235. A protuberance 250 is a spot where the frame scalepackage extends above the level of the lid. This may be done to preventthe operative optical surface 232 of the lid from being scratched. Theglass lid may be bonded to the lid in conventional ways, such as with asilicon sealant.

FIG. 3 shows an alternative frame package which includes an additionalthreaded area 300 above the die 100 and glass lid 230. The additionalarea 300 has inner threads, which are threaded to accept a lens. In thisway, a lens may be mounted within the package, associated with the die.For example, this may enable focusing of certain incoming rays to thedie. While this embodiment shows the inner surfaces as being threaded,it should be understood that other surface features could be usedalternatively to hold the lens in place.

FIG. 4 shows an alternative embodiment in which the frame scale packageincludes multiple indentations, one of which forms a backing portion forthe die. The backing portion 400 is located behind the die 100. In thisembodiment, the frame 420 includes a first indentation portion 422 whichis sized to accept the backing portion 400. The second indentationportion 424 is sized to accept the die 100. The leads 426 are similar tothose in the previous embodiment, but in addition, may travel along thetwo indented portions 422,424. The back plate may allow better sealingof the die against the environment.

Although only a few embodiments have been disclosed in detail above,other modifications are possible. All such modifications are intended tobe encompassed within the following claims.

1. A package for a rectangular integrated circuit, comprising: a frametype package, having a top portion, and a bottom portion which definesat least one indented area where a thickness between the top portion andthe bottom portion is thinner than in a non indented area, said indentedarea sized to accept a rectangular integrated circuit under a thinnedportion of said indented area, and said frame type package including acontact portion, extending along at least said bottom portion and saidindented area, and adapted to connect to said rectangular integratedcircuit around an edge thereof.
 2. A package as in claim 1, wherein saidpackage includes a connection portion, adapted for soldering to saidintegrated circuit.
 3. A package as in claim 2, wherein said integratedcircuit includes an image sensor, and a central portion of said framedefines a portion where image light can enter said image sensor.
 4. Apackage as in claim 1, further comprising an element which allowssealing said integrated circuit relative to the environment.
 5. Apackage as in claim 3, further comprising a clear sealing element whichallows sealing said integrated circuit relative to the environment.
 6. Apackage as in claim 5, wherein said clear sealing element includes aglass lid.
 7. A package as in claim 4, wherein said sealing elementincludes a lid portion on a top of the die and a backing portion on arear portion of the die.
 8. A package as in claim 7, wherein saidindented area includes two separate sized indented areas, one sized toreceive said die, and another sized to receive said backing portion. 9.A package as in claim 5, further comprising an element which protectssaid sealing element against damage.
 10. A package as in claim 9,wherein said element which protects includes an extending part whichextends above a top of said sealing element.
 11. A package as in claim3, further comprising an upper portion on said package, having surfacesadapted to accept a lens therein.
 12. A package as in claim 11, whereinsaid surfaces include screw threads.
 13. A package for an integratedcircuit, comprising: a packaging portion, having an outer perimeter witha metal contact portion thereon, and an inner perimeter, said innerperimeter formed by a downward facing surface with a metal contactthereon, of a type which is adapted to connect to an integrated circuitand a bottom and sideward facing surface also having said metal contactportion thereon, said contact portion extending from said outerperimeter to said downward facing surface.
 14. A package as in claim 13,further comprising an element which seals an inside of said package ascompared with an outside.
 15. A package as in claim 14, wherein saidelement which seals is transparent.
 16. A package as in claim 15,wherein said element is formed of glass, and is hermetically sealedaround an area of said inner perimeter.
 17. A package as in claim 16,further comprising a backing area, hermetically sealing a bottomportion, and wherein said metal contact travels around said bottomportion.